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May 28, 2020

Market analysis: MEMS packaging moves towards wafer level

Market analysis: MEMS packaging moves towards wafer level Traditional MEMS relied on ceramic packaging for a long time. Although effective, the MEMS industry has been brewing into a wafer-level packaging (WLP) technology, and part of the driving force for this transformation

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May 28, 2020

USB sound card production method

USB sound card production method This article introduces a sound card with USB interface, the effect is quite good, the circuit is also very simple. Circuit principle The circuit schematic is shown in Figure 1. PCM2702 (IC1) is a USB interface DAC chip produced by BB, a su

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May 27, 2020

Characteristics and working principle of LCD

Characteristics and working principle of LCD Liquid crystal display (LCD) is a very common display now. It has the advantages of small size, light weight, power saving, low radiation, and easy to carry. The principle of a liquid crystal display (LCD) is very different from a

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