Microelectronics wireless LAN baseband chip gains progress

Recently, the MIMO-OFDM core baseband chip and transmission system for high-speed wireless local area networks developed by IMECAS-BCS, the Institute of Microelectronics of the Chinese Academy of Sciences (CAS) Institute of Microelectronics, has undergone strict regulations. Tripartite test certification and complete the establishment of 8-channel video transmission demonstration system. The results show that the BCS team has made significant progress and significant breakthroughs in the research of key technologies for baseband core chips for IMT-Advanced, next-generation ultra-high-speed wireless local area networks, and mid- and short-range high-speed wireless communications.

Under the support and guidance of Deputy Director Zhou Yumei, under the leadership of Wu Bin, Director of the Broadband Communication System Laboratory, the BCS team, after two years of unremitting efforts, successfully developed two 2-input MIMO-OFDM baseband digital-analog hybrid chips BCS5731. The chip integrates four 80MHz/10bit high-performance ADCs, four 80MHz/10bit high-performance DACs, and a high-performance MIMO-OFDM baseband processor supporting 32 operating modes including SDM, STBC, MRC, and other IEEE802.11a/g/n protocols. The peak throughput rate of the physical layer is 130Mbps, and the chip performance and circuit integration are leading in China. It is the first MIMO-OFDM baseband processor chip that supports the IEEE802.11a/g/n protocol in mainland China.

The chip was tested and certified by the China Electronic Technology Standardization Institute. At the same time, the chip was used to complete 8-channel closed-loop high-definition video transmission system demonstration. The team currently cooperates with many well-known companies in China, such as the transformation of related achievements. This achievement has laid a good technical foundation for the team to develop high-speed wireless communication chips for IMT-Advanced (4G), ultra-high-speed wireless LAN communication chips, and the development and industrialization of medium- and short-distance high-speed wireless communication chips. Related areas High-performance wireless communication chip technology research and development and industrialization process.

This research topic is a major national science and technology project led by the Microelectronic Institute's two-room broadband communication system laboratory. It is carried out under the overall planning target of the “New Generation of Broadband Wireless Mobile Communication Network” special project. "Funds" and "Beijing Science and Technology Star" and other local talents funded.


130Mbps MIMO-OFDM baseband chip BCS5731