The shift of industrial activity towards the east has become one of the most significant trends in mainland China. The global PCB industry's center of gravity continues to move toward Asia, with production capacity gradually relocating to the mainland, creating a new industrial structure. As this trend continues, China has emerged as the world’s largest PCB producer. According to Prismark, China's PCB output value is expected to reach $28.972 billion in 2017, making up over 50% of the global total.
With the rise of data centers, demand for high-density interconnect (HDI) boards is increasing. Flexible printed circuits (FPCs) also hold great potential. Data centers are evolving to support higher speeds, larger capacities, cloud computing, and enhanced performance, driving rapid infrastructure growth. This, in turn, boosts the need for servers, which increases overall HDI demand. Meanwhile, the popularity of mobile electronics like smartphones is further fueling FPC demand. As devices become smarter and lighter, FPCs' advantages—such as being lightweight, thin, and flexible—make them ideal for various applications, including display modules, touch panels, fingerprint sensors, side keys, and power buttons.
Under the pressures of rising raw material costs and stricter environmental regulations, the PCB industry is experiencing greater consolidation. Prices for key materials like copper foil, epoxy resin, and ink have increased, putting more cost pressure on manufacturers. At the same time, the central government has intensified environmental inspections, enforcing strict policies and cracking down on small, inefficient producers. As a result, smaller manufacturers struggle to survive due to limited bargaining power and shrinking profit margins. In this reshuffling phase, leading companies with strong technological and financial resources are well-positioned to grow through expansion, mergers, and product upgrades. Their efficient processes and cost control allow them to benefit directly from industry concentration, leading to a healthier, more rational market.
New applications are also driving PCB growth, especially with the arrival of the 5G era. 5G base stations require a large number of high-frequency circuit boards, with an estimated scale exceeding 10 million—far surpassing the millions seen in the 4G era. These high-speed, high-frequency boards face greater technical challenges than traditional products, offering higher gross margins.
The growing trend of automotive electronics is boosting demand for automotive PCBs. As vehicles become more electronic, the use of PCBs in cars is expanding. New energy vehicles, in particular, require significantly more electronic components compared to traditional cars. While electronics account for about 25% of a traditional luxury car's cost, they make up 45% to 65% in new energy vehicles. Among these, battery management systems (BMS) are becoming a key growth area, and high-frequency PCBs used in millimeter-wave radar systems are generating substantial demand. (PCB Online)
USB 3.2 Cable
The USB 3.2 specification absorbed all prior 3.x specifications. USB 3.2 identifies three transfer rates – 20Gbps, 10Gbps, and 5Gbps.
Key characteristics of the USB 3.2 specification include:
Defines multi-lane operation for new USB 3.2 hosts and devices, allowing for up to two lanes of 10Gbps operation to realize a 20Gbps data transfer rate, without sacrificing cable length
Delivers compelling performance boosts to meet requirements for demanding USB storage, display, and docking applications
Continued use of existing USB physical layer data rates and encoding techniques
Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation
Improved data encoding for more efficient data transfer leading to higher through-put and improved I/O power efficiency
Backwards compatible with all existing USB products; will operate at lowest common speed capability
Usb 3.2 Cable,Usb Type-C Cable,5Gbps Usb Type-C Cable,10Gbps Usb Type-C Cable
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