The global LED packaging industry is generally good

According to GLII incomplete statistics, the global LED packaging output value will increase significantly in 2009 compared with 2009. The primary factor is the huge demand for LED TV backlights from the global TV manufacturers starting in the third quarter of last year, followed by the enhancement of packaged device technology leading to product line transformation and product gross margin improvement. Constantly increasing investment also allows midstream packagers to remain optimistic about the future.

From the perspective of global packaging regions and product distribution, European and American companies are gradually shifting their focus to high-power devices and high-end application devices; Japan still has strong advantages in packaging core processes and technological innovations; Taiwan has experienced a surge in large-size backlight demand since last year. , undertakes more than 60% of SMD LED production capacity worldwide.

In 2010, the global LED packaging industry showed several major characteristics:

First, most chip companies began to get involved in packaging, while gradually reducing the proportion of chip exports, resulting in tight supply of packaged enterprise chips;

Second, traditional semiconductor packaging companies began to test water LED packaging, semiconductor packaging equipment manufacturers gradually increase the development and marketing of LED equipment;

Third, the packaging enterprises are more extended to the downstream application areas, and there are some companies that have some strengths to expand upstream.

According to the national survey data of Gaogong LED “2010 LED Illumination China Tour”, the domestic packaging industry also showed significant positives in 2009-2010. GLII estimates that the overall output value will increase by about 35% compared with last year. The positive performance is mainly reflected in the following aspects:

First, a small number of enterprises have experienced sales and production upside down, and they are in full capacity.

Second, the product structure is accelerating transformation, and traditional in-line products are gradually shifting to high-power SMD. According to incomplete statistics of GLII, the SMD production capacity of the top 100 packaging enterprises in China currently accounts for 35%-60% of the total production capacity of enterprises. More than 30% of enterprises have basically eliminated the inline production line.

Third, domestic packaging equipment gradually penetrated into the high-end device production line, and some equipments already have the strength to compete with imported equipment. This will undoubtedly enable domestic packaging companies to further reduce production costs and enhance product competitiveness.

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