Zhang Zhennan: The application trend of packaging new materials is obvious
On March 21st, the 2014 China LED Lighting Supply Chain Good Product Tour Symposium hosted by Gaogong LED and Zhejiang Lighting Association was held in Hangzhou Huajia Villa.
Gaogong LED, with its excellent suppliers of components and accessories at home and abroad, helps Hangzhou LED lighting companies to further optimize the procurement channels of raw materials for lighting enterprises through on-site display and communication, and through screening and introduction of high-quality, cost-effective upstream yuan. Equipment and lighting accessories resources, in order to improve the quality of LED lighting products, while reducing product costs, to create favorable conditions for the export of Hangzhou LED lamps overseas.
Zhang Zhennan, R&D Manager of Jingtai Optoelectronics, introduced the newly launched PCT material lamp beads at Hangzhou Station. He said that at present, the entire LED packaging industry is still in the stage of driving new materials and new processes.
"The main function of the package is to protect and improve the reliability of the chip, so the choice of packaging materials is particularly important." Zhang Zhennan said, "The most important thing in packaging materials is glue, phosphors and brackets, especially the brackets that solve the heat dissipation of the chip. material."
He said that compared with EMC, PCT 1W products are not lost to EMC 1W products in various performance indicators, and the cost performance is relatively higher. At present, PCT materials are superior to existing conventional PPA materials in high temperature endurance, high temperature long-term yellowing, reflectivity, and UV irradiation, and can be tested by LM-80.
He revealed that some manufacturers have applied PCT materials to TV backlights, high-power lighting SMD LEDs, etc.
Next, the development trend of LED will continue to develop along the direction of high current and high power. The existing materials will still face bottlenecks such as high temperature resistance, long time high temperature operation, yellowing, UV, etc., so the rapid introduction of new materials has become a packaging enterprise. The next step in application development is the direction.
Gaogong LED, with its excellent suppliers of components and accessories at home and abroad, helps Hangzhou LED lighting companies to further optimize the procurement channels of raw materials for lighting enterprises through on-site display and communication, and through screening and introduction of high-quality, cost-effective upstream yuan. Equipment and lighting accessories resources, in order to improve the quality of LED lighting products, while reducing product costs, to create favorable conditions for the export of Hangzhou LED lamps overseas.
Zhang Zhennan, R&D Manager of Jingtai Optoelectronics, introduced the newly launched PCT material lamp beads at Hangzhou Station. He said that at present, the entire LED packaging industry is still in the stage of driving new materials and new processes.
"The main function of the package is to protect and improve the reliability of the chip, so the choice of packaging materials is particularly important." Zhang Zhennan said, "The most important thing in packaging materials is glue, phosphors and brackets, especially the brackets that solve the heat dissipation of the chip. material."
He said that compared with EMC, PCT 1W products are not lost to EMC 1W products in various performance indicators, and the cost performance is relatively higher. At present, PCT materials are superior to existing conventional PPA materials in high temperature endurance, high temperature long-term yellowing, reflectivity, and UV irradiation, and can be tested by LM-80.
He revealed that some manufacturers have applied PCT materials to TV backlights, high-power lighting SMD LEDs, etc.
Next, the development trend of LED will continue to develop along the direction of high current and high power. The existing materials will still face bottlenecks such as high temperature resistance, long time high temperature operation, yellowing, UV, etc., so the rapid introduction of new materials has become a packaging enterprise. The next step in application development is the direction.
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