Intel 14nm process goes smoothly

Intel CTO Justin Rattner disclosed recently that the development of the Intel 14nm process is proceeding as planned and will be put into volume production within one to two years.

At the end of 2013, Intel will complete the development of two new processes, P1272 14nm CPU and P1273 14nm SoC, and increase production investment for Fab D1X in Oregon, Fab 42 in Arizona, and Fab 24 in Ireland. Wait until 2014.

From 2015 onwards, Intel will continue to enter 10nm, 7nm, 5nm and other updated process nodes.

Rattner pointed out that Intel's active advancement of semiconductor technology can allow Moore's Law to continue for at least 10 years.

As an Intel competitor, Samsung is scheduled to mass-produce 20nm in 2013 and begin to develop 14nm. TSMC's 20nm will be put into small-scale production in the second half of 2013, and the first 3D transistor-designed FPGA chip will also start.

GlobalFoundries has just announced that it will trial production of 14nm FinFET process in the first or second quarter of 2013, and mass production in 2014, but before that had to first launched 20nm.

In terms of 450mm wafers, Intel has already joined forces with Samsung and TSMC has invested heavily in ASML in the Netherlands, and has also stepped up efforts to develop EUV lithography. However, the relevant technology production is expected to wait until 2017.