New aluminum substrate solves COB "vulcanization" disease

Aluminum substrates were first used only in some special fields. In recent years, with the rapid development of LED lighting, they have stood out from the big family of PCBs. LED lighting products mainly have three major components: light source, power supply, and substrate. As one of them, the substrate accounts for a large part of the cost of the whole lamp.

The rapid development of LED lighting applications has brought infinite vitality to the aluminum substrate, and the aluminum substrate industry has sprung up everywhere, as if it has sprung up all night, all over the place. From traditional large-scale PCB manufacturers, to home workshops, and some ceramic substrates, they all went together to compete for LED lighting.

At the same time, the competition in the LED auxiliary materials market is no less intense than that in the downstream finished product applications. The price of aluminum substrates ranges from 100 yuan to more than 1,000 yuan per square meter, and the difference is very wide. If you want to kill a bloody road in this "Red Sea", you must know your own positioning, and you must have the core technology research and development capabilities.

New technology and innovation

The technical innovation of the aluminum substrate is more about the package, and some problems appearing in the packaging process are improved. Therefore, the new packaging form is particularly concerned by the aluminum substrate companies, especially the COB package .

Once the COB package is available, it attracts attention from various aspects with low thermal resistance, high luminous efficiency, solder-free, low cost, etc., and is praised by industry experts as one of the top ten trends and hot spots of LED packaging technology in the future. But the COB package is not as good as everyone thought, and it has not been quickly accepted by the market. At present, there are only a few applications on the downlight, so what hinders its popularity?

The thermal power problem of high-power LEDs has been plaguing its application.

"In addition, the point of COB packaging and wire bonding will be vulcanized due to objective reasons, which will lead to yellowing after chip packaging, which will eventually affect light decay, which is one of the cancers affecting the widespread use of COB." Jian Yucang, general manager of Electronics Co., Ltd. said that this is also caused by the conductive integration of the package integration, which is difficult to avoid with the existing packaging process.

In the LED lighting industry, heat conduction and heat dissipation are an important part of current lighting design , especially the heat dissipation of high-power LEDs, which has always been a bottleneck. If the heat transfer and heat dissipation problems are not solved during the design process, this product is very likely to be a waste product! Moreover, the problem of heat conduction has not been solved, and the heat sink is no longer useful.

Most of the LED power is converted into heat, which drastically decays the life of the device. Because aluminum has high thermal conductivity and good heat dissipation, it can effectively transfer internal heat. Therefore, the high-power LEDs and LED lamps currently used are basically soldered on the aluminum substrate, and the aluminum substrate is then passed through the thermal adhesive and the aluminum heat sink. Bonding.

The heat generated by the LED is conducted to the metal substrate through the insulating layer and then transmitted to the heat sink through the thermal interface material, so that most of the heat generated by the LED is diffused into the surrounding air by convection. However, the thermal resistance of the aluminum substrate and the thermal paste is large, thus affecting the light efficiency and life of the LED.

Most ordinary aluminum substrate insulation layers have little thermal conductivity or even thermal conductivity, so that heat cannot be conducted from the LEDs to the heat sink (metal substrate), and the entire heat dissipation channel cannot be unblocked. The thermal accumulation of LEDs quickly leads to LED failure.

It can also be said that in the existing process flow, both ceramic and aluminum substrates are unavoidable, and new technologies are urgently needed to overcome them. Therefore, a PCB-based thermoelectric separation technology is applied to an aluminum substrate, and a COB-dedicated aluminum substrate can not only solve the heat dissipation problem of the package, but also perfectly overcome the vulcanization phenomenon of the COB and improve the light efficiency.

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