Getian Optoelectronics: High-density flip-chip LED module competes for the 2014 Golden Globe Award
According to the reporter's understanding, Getian Optoelectronics has started trial sales of flip-chip LED integrated light source products since last year, and achieved a good market response.
"Compared to the positive and vertical chip packaging methods, the flip-chip LED integrated light source eliminates the need to strike the gold wire, which can effectively avoid various risks caused by the gold wire, such as reducing the probability of dead lights by more than 90%, ensuring the product. The stability, and secondly, the heat dissipation capability of the technology is better than the traditional package.â€ Hu Shuangneng, director of the market of Getian Optoelectronics, told the high-tech LED reporter.
Zhang Hongbiao, research director of the High-tech LED Industry Research Institute, predicts that in the next 2-3 years, flip-chip packaging products will account for 20%-30% of the total package output.
As the first company to get involved in flip chip technology in China, Getian Optoelectronic's flip-chip LED integrated light source has been involved in many subdivisions such as projectors, stage lighting, medical equipment, automotive main lighting, long-distance projection and other special lighting.
Hu Shuangneng said that Getian Optoelectronic's flip chip module products have the following advantages: high power, small light-emitting area can effectively distribute light, realize small-area long-distance light distribution; ceramic substrate design of high thermal conductivity aluminum nitride using thermoelectric separation The thermal resistance is as low as 0.03 Â°C / W, the withstand voltage test exceeds 3000V; the temperature control feedback system is provided, and the heat dissipation temperature is more precise.
2014 (5th) High-tech Golden Globe Award--The annual LED good product selection has been opened, and has entered the enterprise registration stage (June 7-July 31). Known as the "Oscar for the LED industry", this year, it attracts many well-known companies in the industry to participate. This time, Getian Optoelectronics will participate in the series of high-density flip-chip LED modules such as GT-FC-50/FC-75/FC-150/FC-300. This series of products has obtained three invention patents and three practical applications. New patents.
"Compared with the same type of products of traditional vertical and formal structure chips, the flip chip module products can completely surpass them in stability, thermal resistance and brightness. In the future, flip chip technology is expected to become the mainstream of LED packaging." According to Hu Shuangneng Introduction, the current sales of the company's flip chip products are growing very fast. "In the first quarter of this year, the sales of a series of flip chip products of the company has exceeded 5 million."
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